| intCertNum |
2338 |
| strVendorName |
Chunghwa Telecom Co., Ltd. |
| strURL |
http://www.cht.com.tw |
| strAddress1 |
12, Lane 551, Min-Tsu Road SEC.5 |
| strAddress2 |
Yang-Mei |
| strAddress3 |
|
| strCity |
Taoyuan |
| strStateProv |
Taiwan |
| strPostalCode |
326 |
| strCountry |
326 |
| strContact |
Yeou-Fuh Kuan |
| strEmail |
kufo@cht.com.tw |
| strPhone |
+886-3-424-4333 |
| strFax |
+886-3-424-4129 |
| strContact2 |
Char-Shin Miou |
| strEmail2 |
mcs@cht.com.tw |
| strFax2 |
+886-3-424-4129 |
| strPhone2 |
+886 3 424 4381 |
| intCertNum |
2338 |
| strModuleName |
HiCOS Combi PKI Native Smart Card |
| strPartNumber |
Hardware Versions: RS46X and RS47X;
Firmware Versions: HardMask: 2.3 and SoftMask: 3.5 |
| memModuleNotes |
When operated in FIPS mode |
| str140Version |
140-2 |
| _sp_ |
Security Policy [pdf][html][txt] |
| _cert_ |
Certificate [pdf] |
| strPURL |
|
| strModuleType |
Hardware |
| strValidationDate |
03/16/2015 |
| intOverallLevel |
2 |
| memIndividualLevelNotes |
-Cryptographic Module Ports and Interfaces: Level 3;-Roles, Services, and Authentication: Level 3;-Physical Security: Level 3;-EMI/EMC: Level 3;-Design Assurance: Level 3 |
| strFIPSAlgorithms |
Triple-DES (Cert. #1616);
SHS (Cert. #2262);
RSA (Cert. #1393);
DRBG (Cert. #441) |
| strOtherAlgorithms |
NDRNG;
RSA (key wrapping;
key establishment methodology provides 112 bits of encryption strength);
Triple-DES (Cert. #1616, key establishment methodology provides 112-bits of encryption strength;
non-compliant less than 112-bits of encryption strength) |
| strConfiguration |
Single-chip |
| memModuleDescription |
The HiCOS Combi PKI native smart card module is a single chip implementation of a cryptographic module that supports ISO-7816 contact interface and ISO-14443 contactless interface. The HiCOS Combi PKI native smart card module is mounted in an ID-1 class smart card body that adheres to ISO/IEC specifications for Integrated Circuit Chip (ICC) based identification cards. The module consists of the chip (ICC), the contact faceplate, the contactless faceplate, and the electronic connectors between the chip and contact pad/antenna, all contained within an epoxy substrate. |
| intModuleCount |
1 |
| memAdditionalNotes |
|
| strFirstValidtionDate |
03/16/15 00:00:00 |
| strLabName |
CGI |
| strValidationYear |
2015 |